COF (Chip on Film) technology is a chip packaging technique that involves fixing the driver IC to a flexible circuit board. It uses a flexible auxiliary circuit board as a carrier to bond the chip with the flexible substrate circuit. The Bonding machine is a crucial piece of equipment in the COF process, primarily used in the LCD and OLED industries. This equipment includes the complete structure of the Bonding machine and can be modified, edited, and used for reference in related industries. Flexible OLED screen and COF packaging technology.
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